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Foshan Jinxinsheng Vacuum Equipment Co., Ltd.
Foshan Jinxinsheng Vacuum Equipment Co., Ltd.

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Home ProductsMagnetron Sputtering Coating Machine

Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment

Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment

  • Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment
  • Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment
  • Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment
  • Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment
Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment
Product Details:
Place of Origin: China
Brand Name: JXS
Certification: CE
Payment & Shipping Terms:
Minimum Order Quantity: 1 set
Price: As per configuration
Packaging Details: wooden case, plastic film
Delivery Time: 70 working days
Payment Terms: L/C, T/T
Supply Ability: 100 sets/year
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Detailed Product Description
Chamber Material: Stainless Steel 304 Control System: Full Auto, Semi Auto, Manual
Warranty: 1 Year After-Sales: Engineer Available To Service Overseas
Structure: Vertical Front Open Coating Color: Gold, Rose Gold, Blue, Gray, Black
Voltage: 380V, 50Hz Or Custom Made Chamber Size: Custom Made
Pump Group: Mechanical Pump+Roots Pump+Diffusion/Turbo Pump Coating Technology: Multi Arc Or Multi Arc + Magnetron Sputtering Or Magnetron Sputtering
High Light:

thermal evaporation coating unit

,

dlc coating machine

Working Principle: Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). The sputtered ions (typically only a small fraction of the ejected particles are ionized — on the order of 1 percent) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing resputtering). Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk. The entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer, the atomic weight of the sputtering gas should be close to the atomic weight of the target, so for sputtering light elements neon is preferable, while for heavy elements krypton or xenon are used. Reactive gases can also be used to sputter compounds. The compound can be formed on the target surface, in-flight or on the substrate depending on the process parameters. The availability of many parameters that control sputter deposition make it a complex process, but also allow experts a large degree of control over the growth and microstructure of the film.

Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment 0

 

Feature: easy to control film thickness and color, fine and smooth film particle

 

Application: 3C products, watch, jewelry, etc.

 

Green process: no harmful gas, no waste water, no waste material.

Contact Details
Foshan Jinxinsheng Vacuum Equipment Co., Ltd.

Contact Person: cassiel

Tel: +8613929150962

Send your inquiry directly to us
Foshan Jinxinsheng Vacuum Equipment Co., Ltd.
NO.14, the 1st street, Niulanwei Road, Shishan Town, Nanhai District, Foshan, Guangdong, China
Tel:86-757-8253-5205
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