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|Place of Origin:||China|
|Minimum Order Quantity:||1 set|
|Price:||As per configuration|
|Packaging Details:||wooden case, plastic film|
|Delivery Time:||70 working days|
|Payment Terms:||L/C, T/T|
|Supply Ability:||100 sets/year|
|Chamber Material:||Stainless Steel 304||Control System:||Full Auto, Semi Auto, Manual|
|Warranty:||1 Year||After-Sales:||Engineer Available To Service Overseas|
|Structure:||Vertical Front Open||Coating Color:||Gold, Rose Gold, Blue, Gray, Black|
|Voltage:||380V, 50Hz Or Custom Made||Chamber Size:||Custom Made|
|Pump Group:||Mechanical Pump+Roots Pump+Diffusion/Turbo Pump||Coating Technology:||Multi Arc Or Multi Arc + Magnetron Sputtering Or Magnetron Sputtering|
thermal evaporation coating unit,
dlc coating machine
Working Principle: Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). The sputtered ions (typically only a small fraction of the ejected particles are ionized — on the order of 1 percent) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing resputtering). Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk. The entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer, the atomic weight of the sputtering gas should be close to the atomic weight of the target, so for sputtering light elements neon is preferable, while for heavy elements krypton or xenon are used. Reactive gases can also be used to sputter compounds. The compound can be formed on the target surface, in-flight or on the substrate depending on the process parameters. The availability of many parameters that control sputter deposition make it a complex process, but also allow experts a large degree of control over the growth and microstructure of the film.
Feature: easy to control film thickness and color, fine and smooth film particle
Application: 3C products, watch, jewelry, etc.
Green process: no harmful gas, no waste water, no waste material.
Contact Person: cassiel